Different removal methods for parylene coatings

Removal of Parylene coatings
For high reliability electronics in many industries including Aerospace, Defence and Medical, Parylene coatings tend to be the first choice for environmental protection. However being highly resistant to chemicals, gases, liquids, temperature and electrical exposure does make removal and repair a challenge.

Thermal Removal:

While Parylene is heat-resistant, ‘C’ the most common variant for electronic applications will burn off where high temperature is concentrated. A soldering iron under a vacuum hood could be used to burn off at the solder points. Where it is raised from the board the component then lifts off. If the component is sitting tight to the board a blade could be used to carefully cut around the component to make removal easier.

This might be effective for small repairs though it is not the cleanest method, residues and discolouration may result. As Parylene has a high melting point this approach could also pose a risk to heat sensitive substrates.

Laser ablation removes material from the surface by irradiating it with a laser beam. The beam can drill, cut or mark delicate materials with great precision.

Laser ablation, removes very precise areas and tends to fit high density difficult to mask parts. Applications such as microelectronics, electro surgical devices and implantable electrodes that require very small, precise and intricate shapes to be Parylene free would be suited to this approach. It is less likely to be used for the purpose of general rework as it requires capital investment and specific programming that would not be viable for ad-hoc repair and rework.

Chemical removal:

Parylene is highly chemical resistant. No chemical can dissolve it are room temperature. However Tetrahydrofuran an organic solvent can soften the coating; temporarily loosening the adhesion bond between the coating and the substrate so that it can be lifted off like a mask with a tweezers. It is not suited to working with specific areas; in the case of rework and repair this is usually desired.

Mechanical removal:

Parylene is a soft polymer and as such physical, mechanical removal is probably the best method to remove the coating. Using coarse methods such as picking, scraping and cutting can be effective but risk damaging delicate track lines and components.

The most common method to remove Parylene is micro abrasion. This is the fastest and easiest method for both spot and whole board removal. Desktop equipment can be used with a hand held stylus directing pressurized air and abrasive media. Wheat starch is the best for ESD sensitive boards; other common media include sodium bicarbonate and plastic beads. For finer control automated systems are also available.

Once the section is repaired the specific area could be covered with other protective material however for optimum protection the whole board may be recoated in Parylene.

Written by Jason Delaney Technical Sales Manager at Curtiss-Wright

About Curtiss-Wright

Curtiss-Wright is a NYSE listed global diversified industrial company that provides niche highly engineered products and services to industries including Medical, Aerospace, Defence and Energy.

Our Parylene Coating Services was set up in 1991. With founding expertise extending back as part of Union Carbide’s development team who commercialised Parylene over 40 years ago.

Today our ISO13485 certified coating facilities in North America and Europe provide specialist Parylene coatings mainly for the Medical Device, Aerospace and Defence Industries.

Our proprietary Dimers, the precursor for Parylene are over 99.7% pure. These are tested to the requirements of ISO10993 and USP Class VI for bio compatibility and long term implant use. Drug and device master files are held with the FDA.

Our aim is to support R&D and process engineering. We welcome new development and evaluation projects and provide a collaborative low cost and fast turnaround service.                      


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